The centerpiece of the new demolab in Shanghai is the Quantum X align, a high-performance Two-Photon Polymerization (2PP) system designed for high-resolution 3D laser lithography with automated alignment on fibers, chips, and wafers.
A strategic milestone for Nanoscribe in China
Speaking remotely from the company’s headquarters in Germany, Martin Hermatschweiler, CEO and Co-founder of Nanoscribe, emphasized the strategic relevance of China as a key innovation and engineering hub. With a rapidly expanding ecosystem in photonics, optics, and advanced manufacturing, China plays a central role with its drive for innovation and transfer of scientific findings into applications.
"The Shanghai Quantum X demolab is more than a local facility – it represents a milestone in our long-term commitment to the Chinese market," said Hermatschweiler. "By providing access to high-throughput two-photon lithography instrumentation, we enable our customers to accelerate development cycles and bridge the gap from academic proof of concept to industrial-scale production. This is how we actively support the transition from ‘lab to fab’,” he concluded.
Proprietary technologies powering next-generation 3D microfabrication
In a technical keynote, Dr. Wanyin Cui, General Manager of Nanoscribe China, outlined how the Quantum X align addresses key challenges in high-precision microfabrication through Nanoscribe’s proprietary lithography technologies.
Two-Photon Grayscale Lithography (2GL®) extends conventional Two-Photon Polymerization (2PP) by enabling continuous voxel modulation within a single scan process. By combining sub-micron resolution with substantially increased throughput, 2GL® boosts printing speeds by a factor of 10 to 60 compared to traditional approaches at even superior shape accuracy due to more than 4,000 gray levels. This allows the efficient fabrication of complex freeform micro-optics and functional surfaces with optical-grade precision.
Aligned 2-Photon Lithography (A2PL®) enables highly precise 3D printing directly onto existing components and prepatterned substrates such as optical fibers, photonic chips, and wafers. With a lateral alignment accuracy of down to 100 nm relative to markers and fiducials, A2PL® ensures highly accurate placement of optical couplers, significantly reducing coupling losses and enabling scalable photonic packaging workflows.