Aligned 2-Photon Lithography (A2PL®) for photonics packaging

To fabricate efficient optical interconnects for photonic integration, or for miniaturized imaging optics, freeform microoptics can be printed directly onto optical fibers or photonic chips with submicron accuracy, provided by our A2PL microfabrication solution with highest resolution 3D printing and nanoprecision 3D alignment.

Photonics packaging and aligned 3D printing solutions

Optoelectronic components and modules based on photonic integrated circuits (PICs) are on the rise. They are increasingly incorporated into devices for medical sensing, LiDAR systems or quantum computing. This requires industrial solutions for an efficient photonics packaging, which is associated with technical challenges.
The concept of Free Space Microoptical Coupling (FSMOC), realized with 3D-printed microoptical elements precisely 3D-aligned on the facet of optical fibers or on photonic chips, provides a robust and efficient solution for coupling light into photonic chips or to other fiber arrays. These high-precision microoptics either focus or collimate the exceeding light beam of optical fibers or photonic chips onto the facet of photonic chips, enabling mode field conversions or light coupling over distances of up to millimeters.

The A2PL technology in the high-performance 3D printer Quantum X align is designed for manufacturing freeform microoptics automatically aligned on predefined positions for FSMOC applications. The printer’s automatic 3D fiber core detection system and automatic tilt correction guarantee alignment with nanoprecision and highest shape accuracy when printing onto photonic chips, single cleaved fibers or v-groove fiber arrays. 3D-printed microoptics have several advantages over traditional lensed or tapered fibers. Complete control over design parameters of freeform microlenses enables aspheric and asymmetric designs to correct for various aberrations and tailor the beam profile to match almost any coupling application.

Integrated photonics
application opportunities

You want to assess the opportunities for your project in integrated photonics and photonics packaging? Explore the application options of our 3D Microfabrication solutions. Have a look at the 10 most recent scientific publications in integrated photonics and photonics packaging.
To view the details of the publications and to find more research topics and applications in which Nanoscribe 2PP-based 3D printing systems are already successfully used, just enter our premium resources – log in or register for free.

2023/03/23

Two‐Photon Polymerization Lithography for Optics and Photonics: Fundamentals, Materials, Technologies, and Applications

2023/03/12

Free-Form Micro-Optics Enabling Ultra-Broadband Low-Loss Off-Chip Couplin

2023/03/09

Laser-Induced Graphene Hologram Reconfiguration for Countersurveillance Multisecret Sharing

2023/03/02

Fiber-chip link via mode division multiplexing

2023/01/11

Strategies for Integrating Metal Nanoparticles with Two-Photon Polymerization Process: Toward High Resolution Functional Additive Manufacturing

2022/12/13

Optimalisation of 3D laser printing process for highly reflective polymer surfaces

2022/12/13

1 x 9 MMI splitter prepared by 3D lithography and characterized by NSOM

2022/12/09

Plasmonic bound states in the continuum to tailor light-matter coupling

2022/12/07

3D-nanoprinted on-chip antiresonant waveguide with hollow core and microgaps for integrated optofluidic spectroscopy

2022/10/10

Fully integrated four-channel wavelength-division multiplexed QKD receiver

View more innovation projects

You get more publication examples and deeper insights within our premium resources. Via a keyword-underpinned database you find more than 1,400 scientific publications of our customers in specific application areas. Make use of the tool to gather valuable know-how and background information about the manifold application options.

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