Scaling Photonic Computing
Aligned 3D printing for advanced optical coupling in photonic systems
Photonic computing promises ultrafast and energy-efficient information processing – yet scalable packaging remains a decisive bottleneck. How can novel photonic architectures be translated into robust and scalable systems?
This webinar explores the current state of photonic computing, emerging scaling concepts, and a variety of optical interconnect and packaging approaches enabling low-loss, high-performance photonic coupling. A live demonstration will showcase how Aligned 2-Photon Lithography (A2PL®) enables the precise fabrication of scalable coupling structures.
Gain insights into technologies bridging cutting-edge photonic architectures and scalable photonic integration.
Prof. Wolfram Pernice will outline the technological potential of photonic computing, including scaling perspectives beyond electronic architectures, energy-per-operation advantages, and emerging neuromorphic hardware concepts. Building on this, he will examine the integration challenges that currently limit deployment – including optical loss, integration density trade-offs, and thermal and material limitations. From a system architect’s perspective, he will define the packaging requirements that must be met to translate laboratory demonstrators into scalable, application-ready photonic systems.
Erik Jung will present a scalable photonic packaging concept for wafer-scale packing designed for industrial implementation. He will compare established approaches such as edge and grating coupling with advanced interfacing concepts, discussing their respective advantages and limitations. As a key example, he will introduce an innovative plug-and-play fiber-to-chip connector that highlights the advantages of passive alignment over active alignment for volume production.
Tobias Hoose will demonstrate how aligned 3D printing enables highly efficient optical interfaces directly on wafer and chip level. He will explain the alignment workflow, positioning accuracy, and process stability, and show how Two-Photon Grayscale Lithography (2GL®) achieves high shape fidelity and optical surface quality for demanding coupling applications. He will illustrate how additive manufacturing transitions from prototyping to scalable photonic packaging, followed by a live demo using Quantum X align – from CAD design to an aligned coupler in minutes.
Agenda
Moderation by Dr. Jan Szabados, Product Manager at Nanoscribe
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Current architectures and challenges in photonic computing
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Scalable packaging concepts for PIC integration
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Plug-and-play fiber-to-chip interconnects
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Aligned 3D printing with Two-Photon Grayscale Lithography
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Live 3D printing of advanced optical couplers
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Q&A session
Our experts in this webinar
Prof. Wolfram Pernice
Prof. Wolfram Pernice is Director of the Kirchhoff Institute for Physics at Heidelberg University. His research focuses on neuromorphic and quantum photonics, nonlinear integrated optics, and scalable photonic computing architectures, bridging fundamental nanophotonics with system-level integration. He is a recipient of the Gottfried Wilhelm Leibniz Prize (DFG) and has authored numerous high-impact publications in integrated photonics. He also leads the EU Horizon 2020 research project PHOENICS.
Erik Jung
Erik Jung is a senior PhD researcher in the Neuromorphic Quantum Photonics group at Heidelberg University, working with Prof. Wolfram Pernice. His work focuses on scalable photonics packaging and advanced fiber-to-chip interconnect technologies. He developed a low-loss plug-and-play connector enabling robust and automated PIC assembly and contributes to high-performance packaging strategies for next-generation photonic systems.
Tobias Hoose
Tobias Hoose, Senior Process Engineer at Nanoscribe, is an expert in aligned high-precision 3D microfabrication and contributes to several national and international research projects. His work focuses on photonics packaging applications using A2PL® and Two-Photon Grayscale Lithography, enabling the precise fabrication of advanced optical interconnects and scalable coupling solutions for integrated photonic systems.